Products

XPedite7672 | 3U VPX SBC- Intel® Xeon® D Processor-Based 3U VPX-REDI Module with SecureCOTS™
XPedite7672-Photo1-L
Main Features

The XPedite7672 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D processor. The Intel® Xeon® D processor can provide up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package (available Q1 2016, eight-core variations available now). The XPedite7672 is an optimal choice for computationally heavy applications requiring maximum data and information protection.
The XPedite7672 integrates SecureCOTS™ technology with a SmartFusion®2 security SoC for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The SmartFusion®2 can control, intercept, and monitor the Xeon® D subsystem, implement penalties, and interface to the system through single-ended and differential I/O directly connected to the VPX backplane. Circuit board enhancements and optimized Two-Level Maintenance (2LM) metalwork provide additional protection to the physical hardware.
The XPedite7672 maximizes network performance with two 10 Gigabit 10GBASE-KR Ethernet interfaces and two 10/100/1000BASE-T Gigabit Ethernet interfaces. It accommodates up to 16 GB of DDR4-2133 ECC SDRAM in two channels and up to 32 GB of onboard SATA NAND flash in addition to numerous I/O ports, including USB, SATA, and RS-232/422/485 through the backplane connectors. The XPedite7672 provides additional expansion capabilities by including an integrated XMC. This XMC site includes a x8 PCIe connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors.
Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available. The XPedite7672 uses coreboot, powered by Intel®’s Firmware Support Package (FSP), to provide fast boot times and significantly simplify code traceability over legacy BIOS implementations.
SecureCOTS™ is a design methodology from X-ES that provides enhanced levels of security for our products. Its purpose is to help our customers protect sensitive Intellectual Property (IP) and application data from being manipulated, copied, or reverse engineered. All X-ES products are designed, tested, and manufactured in the US.

X-ES products with SecureCOTS™ technology are an ideal starting point for programs that have stringent Anti-Tamper (AT) and Information Assurance (IA) requirements.
SecureCOTS™ features focus on the product’s capability to resist, detect, record, and respond to potential tamper events and can include:
Monitoring, encrypting, and controlling sensitive data paths
Secure erase and declassification of on-board memory
Burying sensitive signals and removing access to test/debug interfaces
Encapsulating sensitive components
Environmental, diagnostic, and situational monitoring
Specialized covers
Intel Trusted Execution Technology (Intel TXT)
Trusted Platform Module (TPM)
Freescale Secure Boot
Integrating FPGAs and utilizing their enhanced security features
SecureCOTS™ features can be included at the component, board, or system level. X-ES has integrated these features into a number of designs, including customer-specific variations of our standard Intel® Core™ i7 and Freescale QorIQ-based products. The X-ES assembly line design process enables these capabilities to be applied across all provided form factors, including 3U & 6U VPX, VME, 3U & 6U CompactPCI (cPCI), XMC / PMC, and COM Express.

Processor
Intel® Xeon® D (formerly Broadwell-DE)
Eight Xeon®-class cores in a single, power-efficient SoC package (available now)
12 or 16 Xeon®-class cores in a single, power-efficient SoC package (available Q1 2016)
Extended temperature Intel® Xeon® D processors (available Q1 2016)
Memory
Up to 16 GB of DDR4-2133 ECC SDRAM in two channels
Up to 32 GB of SLC NAND flash
32 MB NOR boot flash
64 kB EEPROM
XMC Site
x8 PCI Express Gen3-capable port
One SATA port
Six SmartFusion®2 GPIO
VPX (VITA 46) P0 I/O
Two SmartFusion®2 I²C ports
VPX (VITA 46) P1 I/O
x4 PCI Express Gen3-capable interface to P1.A
x4 PCI Express Gen3-capable interface to P1.B
Two 10GBASE-KR Ethernet ports
XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
VPX (VITA 46) P2 I/O
Two 10/100/1000BASE-T Gigabit Ethernet ports
Four SATA ports capable of 6 Gb/s
Two USB 2.0 ports
Four RS-232/422/485 serial ports
Single-ended and differential GPIO from SmartFusion®2
Security and Management
SmartFusion®2 security FPGA with 1 GB DDR3-667 ECC SDRAM and 32 MB SPI flash
SmartFusion®2 zeroization
System voltage monitor, power-on/reset control, non-volatile write-protection control
Non-Deterministic Random Number Generator, Encryption
Environmental sensors (see product manual)
Trusted Platform Module (TPM) 1.2 or 2.0
Software Support
coreboot firmware powered by Intel® FSP
Wind River VxWorks BSP
X-ES Enterprise Linux (XEL) BSP
Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers
Physical Characteristics
3U VPX-REDI conduction- or air-cooled form factor
Dimensions: 100 mm x 160 mm
0.8 in. pitch without solder-side cover
1.0 in. pitch with Two-Level Maintenance (2LM) support (optional)
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
Conformal coating available as an ordering option
Thermal performance will vary based on CPU frequency and application
Power Requirements
Power will vary based on configuration and usage.

XPedite7672 data sheet

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