Since unveiling its first single board computers (SBCs) based on the Intel® Xeon® D-1500 family of processors in 2015, Extreme Engineering Solutions (X-ES) has developed an industry-leading portfolio of embedded Xeon® D products that serves as the basis for continued innovation.
These embedded single board computers offer a feature-rich computing solution that is well-suited to a broad range of industries and applications, from challenging industrial environments to rugged defense deployments. Reduce Project Risk with Proven Intel® Xeon® D Solutions Intel® Xeon® D processor boards from X-ES encompass a wide range of functionality in both standard and custom form factors, including 3U VPX, 6U VPX, and COM Express. To date, the company has delivered at least one unit for each of 16 Xeon® D processor-based products, in over 90 distinct configurations. This portfolio includes a number of complex designs with features such as dual mezzanine support and integrated FPGAs. Keeping pace with strong demand from the defense and aerospace sectors, X-ES continues to introduce new products and features to our Xeon® D lineup. Our talented design engineering team draws upon an impressive breadth of experience with this architecture to minimize risk for even the most challenging designs. Xeon® D Targets the High-Performance Embedded Market The Intel® Xeon® D-1500 processor family (formerly Broadwell DE) offers a combination of performance and reduced power consumption optimized for compute-intensive embedded applications. It removes the graphics support often seen in the Intel® Core™ i7 series of processors, leaving more chip resources dedicated to raw compute and allowing up to 16 Xeon®-class cores in a single, power-efficient Systemon-Chip (SoC) package. Xeon® D is also the first Intel® processor with native extended temperature support, a key requirement for many defense and aerospace applications. Xeon® D processors with up to 12 cores are rated by the manufacturer for an operating temperature range of -40⁰C to 85⁰C. Rugged and Secure Implementations Xeon® D SBCs from X-ES are engineered to withstand a dizzying array of environmental extremes. Their ruggedization techniques include Class III printed circuit board (PCB) assemblies to improve reliability across temperature variations; mounting holes positioned to minimize the effects of vibration; and hybrid copper and aluminum heat frames that optimize thermal performance while reducing overall weight. All X-ES SBCs undergo thermal and structural qualification in accordance with MIL-STD-810F specifications. For applications that require maximum data and information protection, X-ES offers several Xeon® D SBCs with integrated SecureCOTS™ technology. These SBCs pair the Xeon® D processor with a security SoC or FPGA capable of hosting custom functions to protect data from being modified or observed. • The XPedite7672 3U VPX SBC and XCalibur4646 6U VPX SBC implement SecureCOTS™ functions with a Microsemi SmartFusion2 security SoC. Both include multiple 10 Gigabit Ethernet and Gigabit Ethernet interfaces as well as XMC support. • The XPedite7674 3U VPX SBC and XCalibur4643 6U VPX SBC implement SecureCOTS™ functions with a Xilinx Kintex® UltraScale™ FPGA. This FPGA boasts low-power, high-performance DSP capabilities, making it ideal for applications such as radar and sonar processing and signals intelligence. The XPedite7674 and XCalibur4643 both include multiple 10 Gigabit Ethernet and Gigabit Ethernet interfaces as well as XMC support. COTS Systems Enable Rapid Deployment For lower costs and faster deployment, 3U VPX modules based on the Xeon® D processor can be installed in a commercial-off-the-shelf (COTS) rugged chassis from X-ES’ popular XPand6200 Series. These sub-½ ATR systems have a lightweight two-slot design that incorporates the latest power-saving and performance-enhancing technology
Intel® Xeon® D processor boards from X-ES encompass a wide range of functionality in both standard and custom form factors, including 3U VPX, 6U VPX, and COM Express®.
To date, Extreme Engineering has delivered at least one unit for each of 16 Xeon® D processor-based products, in over 90 distinct configurations. This portfolio includes a number of complex designs with features such as dual mezzanine support and integrated FPGAs.
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